var fDesc=new Array(); fDesc[0] = "ThSim is a simulation program for evaluating thermal conduction in solid material. This solid material can consist of multiple cubes of different material properties.

A typical use is transient temperature rises in semiconductors, down to very short events where measurements are no longer possible.

For temperature calculations the transient analysis of SPICE is used."; function tShowHide(id, show) { var s = document.getElementById("desc"); if ((s.innerHTML.length<=212 || show==1) && show!=2) { s.innerHTML = fDesc[id]; if (document.getElementById('m1')) document.getElementById('m1').style.display='none'; if (document.getElementById('m2')) document.getElementById('m2').style.display='none'; if (document.getElementById('more_txt')) document.getElementById('more_txt').style.display='inline'; } else { s.innerHTML = ''; } }